flip chip bonder

Flip-chip bonding » Ajat 這個社會需要關懷..... AJAT is using a Suss MicroTec FC150 flip chip bonder. It is automated device bonder for high precision application, development and production capabilities. The alignment accuracy of the bonder is ± 1µm. This bonder has a laser leveling feature which leve...

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Die Bonder, Flip Chip Bonder, Wafer Ink Systems and more - AMICRA Microtechnologies - AMICRA microte 繼之前一陣爆紅的“杜甫很忙”之後, 網友依然繼續不停的讓杜甫的生活多樣性~ 到底為何大家如此喜歡惡搞杜甫呢??   沒看過之前的這邊請:”杜甫很忙“傳送門     杜甫開始展開他的少女情懷了 >   少女情懷2AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microelectro...

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Flip Chip - SUSS MicroTec              Flip chip, also known as Controlled Collapse Chip Connection (C4), is a direct method for mounting semiconductor devices on a circuit board using 3D contacts. These drops of solder or “microbumps” are deposited on the chip pads, on the top side of the waf...

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Flip Chip & MEMS Assembly with High-Mix, Automatic Die Sorters 7月7日,河北省張家口市首台被稱為“霧炮”的多功能抑塵車正式上崗。該多功能抑塵車攜帶可向空中發射水霧的噴灑系統,能夠將水霧噴灑100米遠、60米高,達到快速抑制灰塵的目​​的。   7月7日,河北省張家口市首台被稱為“霧炮”的多功能抑塵車正Palomar Technologies would like to thank Sarah Kinzli and the Royce Instruments team for their valuable overview of die sorting solutions. The Royce MP-300 and DE35-ST die sorters will enhance your automated die attach processes on a 3800 Die Bonder, 6500...

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FINEPLACER® femto - Automated Sub-micron Die Bonder不知道大家是否知道“彩虹貓”這人物? 但就在2011年有人製作了10小時的洗腦版本!! 你沒看錯, 真的是 10小時!!!     接著就有一名外國網友, 錄了一段長達10小時的收看實況.... 沒錯,他非常完整的記錄了     但有人Automated, sub-micron die bonder for flip chip bonding and optoelectronic applications, versatile platform for various assembly technologies including thermosonic bonding, ultrasonic bonding, adhesives, soldering, UV curing. ... The FINEPLACER ® femto is ...

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