uv tape wafer

ICROS backgrinding wafer tape > Semiconductor and Integrated Circuit tape 原本看起來可口美味的爆漿餡餅,多了眼睛看起來像反胃嘔吐的樣子...... 插座多了雙眼睛,看起來吃驚又可愛呢~~~ 加上眼睛後看起來有點像......沒牙齒的可愛老爺爺?!這也讓人想起之前很火紅的惡搞動畫「惱人的橘子」!!!大家可以再去回味一下喲~~~ 懷孕的圓滾滾肚皮也被惡搞一下,再配上兩顆圓又ICROS TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. ... ICROS TAPE is a surface protective tape used in silicon wafer back-grinding process for the manufacturer of integrated circu...

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UV Curable Dicing Tape據說古時日本多戰事男丁少,人口急遽下降。為提高出生率,天皇下令男人可以隨時隨地和女人做愛。於是女人為了做事方便,出門圍條床單和背個枕頭,久而久之就成了和服。生的孩子就以做愛地點為姓,於是便有了松下、井上、渡邊、田中、山口、小泉等姓。這就是日本的和服和姓氏的來源考證。 Benefits There is a Semiconductor Equipment Tape that is Perfect for Your Application. Semiconductor Equipment Corporation's Wafer Dicing Tape is a flexible PVC with synthetic acrylic adhesive bonded to one side. It is tough, has high tear strength and el...

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BG Tape | Adwill:Semiconductor-related Products | LINTEC Corporation                               網戀什麼的再也不相信了◢▆▅▄▃ 崩╰(〒皿〒)╯潰 ▃▄▅▆◣Leading-edge Tape $B!_ (B Equipment solution created with semiconductor-related products 'Adwill.' Wafer surface protection tapes and peeling tapes for the back grinding Process. ... Two types of back grinding tape are available: UV curable type, “E serie...

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Pantech Tape Co., Ltd. Dicing UV tape for PCB 太好笑了!輪胎哥你很幽默歐~~~~~~~~~  PanTech PCB Dicing UV tape is an adhesive tape specially designed for dicing of LED module, QFN, glass IC chips, and various kinds of PCB modules. It sustains a strong adhesion and turns to very low adhesion after UV exposure. This tape can hold the chips...

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S.E.C. Tape for Semiconductor Wafer Dicing and Hybrid Substrate Sawing 想為你的日常沐浴增加樂趣嗎?想讓你的浴缸充滿色彩嗎?近日,日本流行用熒光棒裝飾浴缸,為你的沐浴打造別樣的浪漫氣氛。這一創意提出後迅速在日本走紅。在過去的幾天裡,許多人都嘗試了這一創意,並將他們用熒光棒“點燃”浴缸的照片上傳到網上。如果你有觀看演唱會或聚會後留下的殘留熒光棒,For nearly 30 years Semiconductor Equipment Corporation has set the standard for high quality semiconductor Dicing Tape. We inventory a variety of tapes which are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sa...

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