wafer level package led

Wafer Level Chip Scale LED Package -   這件事絕對不能跟日本人學!!太可怕啦!!   明明長的清秀,身材也都不錯 為什麼要把自己弄成這樣… 當我收到這些照片時,底下還有這麼一句話~~ 鬼~~~這一定是鬼~~~   Z Tech of Wafer Level Chip Scale LED Package - Major Features of Z tech, Min. PKG size < 0.3x0.3x0.12, Thick Cu Solderable Pads for High Thermal Dissipation, Vertical Current Spreading between the Whole Surfaces of n- and p-GaN...

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Wafer Level Packaging | Solid State Technology 前幾日,發生一件“有屎以來”最“黃”最暴力的事件!! 是這樣的… 本來一臺水肥車在街邊正常工作… 但是不知道什麼原因,突然之間… 爆啦!!   爆炸啊!!這味道!!!     這BiTS: The ever-shrinking package underscores emerging challenges and solutions 02/25/2016 What’s the single area that is being most disrupted by emergent technologies like the Internet of Things (or the Internet of Vehicles) and Silicon Photonics? We thin...

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Wafer-level SiP yields 5X footprint reduction | Electronics EETimes 所謂的密集恐懼症,簡單的說就是看到很多東西密集的排列再一起會感覺到噁心、想吐、頭暈......等等不舒服的症狀 現在趕緊來測試一下吧!     先從簡單的開始             還撐得住嗎? 再來是進階Portuguese OSATS company Nanium S. A. has pushed its wafer-level packaging expertise to 3D SiPs, under a new packaging technology dubbed WLSiP/WL3D for 3D Wafer-Level System-in-Package. The new packaging technology was initiated from a specific ......

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Wafer Level Packaging - SUSS MicroTec 推特網友「chyaraizumi」 表示有約會的日子,他的早上是這樣度過的:1.洗個熱水澡;2.梳好睡炸起來的頭毛兒;3. 化妝,打理好髮型;4.帶上美瞳,帥帥地出門啦! …………突然覺得不僅約女生要潑卸妝水,約男生也需要惹…&Wafer-level packaging (WLP) is a conventional packaging technology used for semiconductors, microsystems and other elements. All steps of IC packaging are performed at wafer level, that is, prior to singulation. This results in devices that are not much l...

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Fan-out wafer level packaging set to expand | Solid State Technology NAVY CONCISE PRODUCTION 海軍藍色系運動商品全台上市! 近年來運動元素於時裝界持續引起熱潮,台灣街頭品牌NAVY今年冬季特別推出了全新NC支線”NAVY CONCISE PRODUCTION”,運用獨家開發的混紡花紗面料,打造出一系列以海軍藍色系為主軸The expansion of fan-out is finally coming, says Rich Rogoff, Vice President and General Manager, Lithography Systems Group at Rudolph Technologies. Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-...

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