Silverlight Briefing - MIX07 - 晴華科技電子有限公司
Item Standard Unit Specification Insulation thickness (導熱絕緣層厚度) μm Max Min 150 60 Copper layer thickness (銅箔層厚度) μm Max Min 175(5 oz) 17.5(0.5oz) Thermal conductivity (絕緣層熱導率,K值) ASTM E1461 W/m Min 2.0/3.0/5.0 Thermal ......