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IFTLE 176 2013 IEDM; Micron, TSMC, Tohoku Univ., NC State, ASET | Insights From Leading Edge

The 2013 IEEE IEDM was held in WDC the 2 nd week of Dec. Let’s take a look at some of the key 3DIC presentations there. Chamdrasekaran addressed challenges in future memory manufacturing for both front end 3D NAND and back end 3DIC stacking. He does not s...

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