GAAS: 3D Wideband Package Solution Using MCM-D BCB Technology for Tile TR Module
The electrical characterisation of the BCB substrate shows 0,9dB/cm insertion loss at 20GHz for a 18µm thick substrate, and 0,4dB/cm insertion loss for a 45µm thick substrate. The electrical resistance of the vias varies from 5mΩ to 6mΩ whatever the thick...