A Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging using Electroless Nickel Gold Bum
A Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging using Electroless Nickel Gold Bumping T. Oppert, T. Teutsch, E. Zakel Pac Tech – Packaging Technologies GmbH Am Schlangenhorst 15 -17, Germany Phone: +49 (0)3321/4495 -0 Fax ......