Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) Kyoung-Lim Suk a, Ho-Young Son a, Chang-Kyu Chung a, Joong Do Kim b, Jin-Woo Lee b, Kyung ......