Fine Pitch Copper Wire Bonding Process and Materials Study
1 Fine Pitch Copper Wire Bonding Process and Materials Study L. A. Lim ASM Technology Singapore Pte. Ltd. 2 Yishun Avenue 7, Singapore 768924 Jimmy Castaneda SPT Asia Pte. Ltd. 970 Toa Payoh North #07-25/26, Singapore 318992 Shinji Shirakawa...