TSMC integrated Fan-Out WLP: a closer look
TSMC also compared InFO-WLP to a multi-chip FC-BGA package [a package size of 8x8 mm2, with one baseband chip of size 5x5 mm2, two smaller chips of size 2x1.25 mm2, ambient temperature of 25 ˚C, and total power of 2 W consistent with a typical mobile ......
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