Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies
246 International Microelectronics and Packaging Society The International Journal of Microcircuits and Electronic Packaging, Volume 24, Number 2, Third Quarter, 2001 (ISSN 1063-1674) Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies ......