Novel Heterogeneous Integration Technology of III–V Layers and InGaAs FinFETs to Silicon - Dai - 201
Dai, X., Nguyen, B.-M., Hwang, Y., Soci, C. and Dayeh, S. A. (2014), Novel Heterogeneous Integration Technology of III–V Layers and InGaAs FinFETs to Silicon. Adv. Funct. Mater., 24: 4420–4426. doi: 10.1002/adfm.201400105 Author Information 1...