Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies
International Microelectronics and Packaging Society 247 Key words Eutectic Sn-Pb solder bump, eutectic Sn-Pb bumped FC assembly, accelerated reliability test, reliability, Sn-Ni intermetallic compound. 1. Introduction The flip chip (FC) technology has ma...