Wafer-to-Wafer Bonding and Packaging - Berkeley Sensor & Actuator Center
1 U. Srinivasan © EE C245 Wafer-to-Wafer Bonding and Packaging Dr. Thara Srinivasan Lecture 25 Picture credit: Radant MEMS 2 U. Srinivasan © EE C245 Lecture Outline • Reading • Senturia, S., Chapter 17, “Packaging.” • Schmidt, M. A. “Wafer-to-Wafer ......