宜特科技 | IC打線(Wire Bonding)
機型 Maximum Wire Length Total Bond Placement Accuracy Bonding Area Bond Force Maxum(金線機) 7.6 mm(0.3in) ±3.5um X Axis 56mm Y Axis 66mm (2.2 X 2.6 in) Minimum:5 grams Maximum:300 grams Ultra(金線機) 7.6 mm(0.3in) ±2.5um X Axis 56mm...