半導體製程介 - 國立中山大學企業管理學系
齐 룋걹땻銂獳敭扬礩 Front End Back End Back side grinding Molding Wafer plasma Dejunk/Trim Wafer mount Epoxy cure Wire bond Die attach Back side marking Wafer saw Post mold cure 2nd optical insp. Electric Deflash UV erase Solder plating Ink marking ......