IMAPS - Topical Workshop & Tabletop Exhibition on Wire Bonding 2014
Semiconductor Market Update & Outlook: From Bonding Wire Perspective (45 min.) Bud Crockett Jr., Tanaka Denshi Group Saga The Future of Packaging - The Relevance of Wire Bonding (45 min.) Bob Chylak, Kulicke & Soffa Break in Exhibits: 10:15 am - 11:00 ......